3401.26.0012-EX
H+S | |
---|---|
Side of bulkhead | protected side |
Gas tube | Yes DC, GDT included, replaceable, 9071.99.0647 (SEMPER, 230 V) |
DC current | ≤ 2.5 A at 48 V , 2.5 A |
PIM 3rd order | 0 dBc |
Moisture resistance according | MIL-STD-202, Method 106 |
Impedance | 50 Ω |
Power avg. / peak | 150 W / - |
Vibration according | MIL-STD-202, Method 204, Cond. D |
Insertion loss | 0.1 dB |
Storage temperature | -40 °C ... 85 °C |
Operation temperature | -40 °C ... 85 °C |
Residual pulse energy (typ.) | 350 µJ (test pulse 4 kV 1.2/50 µs; 2 kA 8/20 µs) |
Product description | GDT technology up to 1.0 GHz |
Thermal shock according | MIL-STD-202, Method 107, Cond. B |
DC supply voltage | 48 V |
Insertion loss typical | 0.1 dB |
Product code | 3401.26.0012-EX |
Main path connectors | Port 1: unprotected, TNC jack (female)Port 2: protected, TNC jack (female) |
Housing material / plating | Brass / SUCOPLATE (R) Plating |
Turn-off time | 20 sec. typically at 2.0 A and 25°C ambient temperature |
Ingress protection (IP Rating) | IP64 |
Frequency frame | 0 MHz to 1000 MHz |
Mounting and grounding | MH12 (bulkhead mounting) |
Residual pulse voltage (typ.) | 650 V (test pulse 4 kV 1.2/50 µs; 2 kA 8/20 µs) |
Return loss typical | 19 dB , 26.44 dB |
Surge current handling capability | 30 kA single, 20 kA multiple (test pulse 8/20 µs) |
Center contact, material / plating | Port 1: Copper Beryllium Alloy / Gold Plating (without Nickel underplating)Port 2: Copper Beryllium Alloy / Gold Plating (without Nickel underplating) |
Recovery time | 7 sec. at 25°C ambient temperature |
EMP can be install reversed | YES |
Frequency range | 0 MHz ... 300 MHz |
Mating cycles | 500 |
CW power frame | 150 W |
Weight | 77 g |