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3401.26.C
| H+S | |
|---|---|
| Side of bulkhead | protected side |
| Gas tube | Yes DC, GDT not included |
| Moisture resistance according | MIL-STD-202, Method 106 |
| Impedance | 50 Ω |
| Power avg. / peak | ≤150 W / - |
| Vibration according | MIL-STD-202, Method 204, Cond. D |
| Insertion loss | ≤ 0.1 dB |
| Storage temperature | -40 °C ... 85 °C |
| Operation temperature | -40 °C ... 85 °C |
| Residual pulse energy (typ.) | 350 µJ (test pulse 4 kV 1.2/50 µs; 2 kA 8/20 µs) |
| Product description | GDT technology up to 1.0 GHz |
| Thermal shock according | MIL-STD-202, Method 107, Cond. B |
| Insertion loss typical | ≤ 0.1 dB |
| Product code | 3401.26.C |
| Main path connectors | Port 1: unprotected, TNC plug (male)Port 2: protected, TNC jack (female) |
| Housing material / plating | Brass / SUCOPLATE (R) Plating |
| Electrical remarks | Data refer to GDT 9071.99.0547, 230 V |
| Ingress protection (IP Rating) | IP20 |
| Frequency frame | 0 MHz to 1000 MHz |
| Mounting and grounding | MH12 (bulkhead mounting) |
| Residual pulse voltage (typ.) | 650 V (test pulse 4 kV 1.2/50 µs; 2 kA 8/20 µs) |
| Return loss typical | ≥ 19 dB , ≥ 26.44 dB |
| Surge current handling capability | 30 kA single, 20 kA multiple (test pulse 8/20 µs) |
| Center contact, material / plating | Port 1: Brass / Gold Plating (without Nickel underplating)Port 2: Copper Beryllium Alloy / Gold Plating (without Nickel underplating) |
| EMP can be install reversed | YES |
| Frequency range | 0 MHz ... 300 MHz |
| Mating cycles | 500 |
| CW power frame | ≤ 150 W |
| Weight | 90 g |
