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81_SMP-S50-0-S1/111_NE
| H+S | |
|---|---|
| Insulator | PAI (Polyamide-imide) |
| Centre contact | Copper Beryllium Alloy / Gold Plating (Nickel underplated) |
| Engagement force max | 8.9 N |
| Connector type | Straight PCB plug |
| Board mounting type | surface mount |
| Disengagement force (to) | 2.22 N |
| Standard | MIL-STD-348 SMP |
| Mating cycles | 1000 |
| Product code | 81_SMP-S50-0-S1/111_N |
| Height above PCB HA | 4.57 mm |
| Weight | 0.00025 kg |
| Interface frequency | 40 GHz |
| Interface type | SMP |
| Gender | plug |
| Operation temperature | -55 °C ... 125 °C |
| Body | Brass / Gold Plating (Nickel underplated) |
| Impedance | 50 Ω |
| Outer conductor | Brass / Gold Plating (Nickel underplated) |
