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3402.17.0072-EX
| H+S | |
|---|---|
| Side of bulkhead | protected side |
| Gas tube | Yes DC, GDT included, replaceable, 9071.99.0647 (SEMPER, 230 V) |
| DC current | ≤ 2.5 A at 48 V , 2.5 A |
| Moisture resistance according | MIL-STD-202, Method 106 |
| Impedance | 50 Ω |
| Vibration according | MIL-STD-202, Method 204, Cond. D |
| Storage temperature | -40 °C ... 85 °C |
| Operation temperature | -40 °C ... 85 °C |
| Residual pulse energy (typ.) | 350 µJ (test pulse 4 kV 1.2/50 µs; 2 kA 8/20 µs) |
| Product description | GDT technology up to 2.5 GHz |
| Thermal shock according | MIL-STD-202, Method 107, Cond. B |
| DC supply voltage | 48 V |
| Insertion loss typical | ≤ 0.2 dB |
| Product code | 3402.17.0072-EX |
| Main path connectors | Port 1: unprotected, N jack (female)Port 2: protected, N jack (female) |
| Housing material / plating | Brass / SUCOPLATE (R) Plating |
| Turn-off time | 20 sec. typically at 2.0 A and 25°C ambient temperature |
| Ingress protection (IP Rating) | IP65 |
| Frequency frame | 0 MHz to 2500 MHz |
| Mounting and grounding | MH25 (bulkhead mounting) |
| Residual pulse voltage (typ.) | 650 V (test pulse 4 kV 1.2/50 µs; 2 kA 8/20 µs) |
| Return loss typical | ≥ 20 dB |
| Surge current handling capability | 30 kA single, 20 kA multiple (test pulse 8/20 µs) |
| Center contact, material / plating | Port 1: Copper Beryllium Alloy / Gold Plating (without Nickel underplating)Port 2: Copper Beryllium Alloy / Gold Plating (without Nickel underplating) |
| Recovery time | 7 sec. at 25°C ambient temperature |
| EMP can be install reversed | YES |
| Mating cycles | 500 |
| CW power frame | ≤ 150 W |
| Weight | 126 g |
